Ultra-High Purity Tungsten Sputtering Targets (W Targets)
As leading PVD Target Suppliers, we provide 99.95% pure Tungsten Sputtering Targets for semiconductor, aerospace, and display industries, ensuring exceptional film uniformity and deposition rates.
- Material Excellence
99.95% purity with controlled oxygen/carbon content
Fully dense microstructure (＞99.5% T.D.) - Precision Engineering
Custom geometries: planar, rotary, bonded targets up to 500mm diameter
Surface roughness mirror finish available - Performance Optimized
Sputtering yield 15-20% higher than industry average
Thermal shock resistance up to 2000°C
Engineered for Precision: Tungsten Sputter Target Solutions
Our Tungsten Sputtering Targets are vacuum hot-pressed using proprietary HIP technology, achieving superior grain structure uniformity (<50μm grain size). The targets feature:
- Low Particulate Generation – Special edge treatment reduces arcing
- Thermal Stability – Withstand 2000°C+ operating temperatures
- Bonding Options – Indium/Elastomer bonding for improved heat dissipation
- Ideal for DC/RF sputtering systems, these Tungsten Sputtering Targets demonstrate
- 30% longer service life vs. industry average• ≤3% thickness uniformity across entire surface
Tungsten Target Physical Parameters
| Parameter | Standard Spec |
| Purity | 99.95% |
| Density | ≥18.9 g/cm³ |
| Dimensions | Ø50-300mm |
| Thickness | 3-20mm |
| Orientation | Random |
As specialized Sputter Target manufacturers waht we deliver
- Turnkey Service – From alloy design to post-sputtering analysis
- Traceability – Full material genealogy reports with Lot ID tracking
- Technical Support – 24/7 process optimization consulting
Tungsten Target Applications
Critical Thin Film Solutions
- SemiconductorGate
electrodes in 3nm/5nm nodes
Barrier layers for Cu interconnects - Aerospace
Thermal protection coatings for re-entry vehicles
X-ray collimators in satellite systems - Flat Panel Displays
TFT-LCD bus lines
OLED encapsulation layers
Ultra-High Purity Tungsten Sputtering Target FAQ
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